{"version":1,"type":"story","url":"https://digestai.news/story/nvidia-and-spil-plan-15x-expansion-of-co-packaged-optics-capacity-by-m","json":"https://digestai.news/story/nvidia-and-spil-plan-15x-expansion-of-co-packaged-optics-capacity-by-m.json","markdown":"https://digestai.news/story/nvidia-and-spil-plan-15x-expansion-of-co-packaged-optics-capacity-by-m.md","slug":"nvidia-and-spil-plan-15x-expansion-of-co-packaged-optics-capacity-by-m","headline":"Nvidia and SPIL plan 15x expansion of co-packaged optics capacity by mid-2027","summary":"Nvidia CEO Jensen Huang announced at GTC Berlin that the company and packaging partner Siliconware Precision Industries (SPIL) will expand co-packaged optics (CPO) optical-engine capacity by 15 times by mid-2027, with a further doubling to 30 times by end of 2028. Huang said optical networking demand in AI data centers could grow 15 times as copper interconnects hit physical limits on power, signal degradation, and bandwidth density. Nvidia is introducing Spectrum-6 CPO switches for its Vera Rubin AI factories, promising higher bandwidth density and lower energy use. The company also committed $1.1 billion to advance US semiconductor testing capacity with KYEC, targeting production start in April 2027, while Amkor plans to grow interposer wafer production capacity by over 300% by end of 2028.","keyPoints":["Nvidia and SPIL target 15x CPO capacity increase by mid-2027, 30x by end of 2028","Nvidia commits $1.1 billion with KYEC for US semiconductor testing, production from April 2027","Amkor plans over 300% interposer wafer capacity growth by end of 2028"],"whyItMatters":"The massive CPO capacity expansion signals Nvidia's bet that optical interconnects will replace copper as AI clusters scale, addressing power and bandwidth bottlenecks in next-generation data centers.","category":{"slug":"hardware","name":"Hardware & Compute","url":"https://digestai.news/category/hardware"},"entities":{"companies":["Nvidia","Siliconware Precision Industries","KYEC","Amkor"],"models":[],"people":["Jensen Huang"]},"firstPublishedAt":"2026-10-24T14:23:00Z","updatedAt":"2026-10-24T14:23:00Z","sourceCount":1,"hasPrimarySource":false,"sources":[{"outlet":"cryptobriefing.com","title":"Nvidia and SPIL plan 15x expansion of co-packaged optics capacity by mid-2027","url":"https://cryptobriefing.com/nvidia-jensen-huang-optical-volume-ai-data-centers","publishedAt":"2026-10-24T14:23:00Z","type":"press","primary":false,"lead":true}],"sourceNotes":null,"discussions":[],"thread":{"title":"Nvidia Expands AI Chip Supply Chain","url":"https://digestai.news/thread/nvidia-pays-1-1b-to-kyec-for-us-test-capacity","storyCount":3},"cite":{"text":"Digest AI, \"Nvidia and SPIL plan 15x expansion of co-packaged optics capacity by mid-2027\", 24 October 2026, https://digestai.news/story/nvidia-and-spil-plan-15x-expansion-of-co-packaged-optics-capacity-by-m","publisher":"Digest AI","title":"Nvidia and SPIL plan 15x expansion of co-packaged optics capacity by mid-2027","datePublished":"2026-10-24T14:23:00Z","url":"https://digestai.news/story/nvidia-and-spil-plan-15x-expansion-of-co-packaged-optics-capacity-by-m"},"generatedBy":"Written by Digest AI's editorial model from the linked sources; the sources are the record.","license":"Headlines, digests and key points are written by Digest AI and may be quoted with a link to the story page. Linked articles belong to their publishers. Terms: https://digestai.news/terms#reuse"}