Applied Materials and Intel expand AI chipmaking collaboration at epic Center
Applied Materials and Intel announced on October 6, 2026, that they are deepening their partnership to accelerate AI chipmaking innovations. The collaboration ties Applied’s EPIC Center in Silicon Valley with Intel’s research campus in Hillsboro, Oregon, focusing on next-generation transistors, interconnects, and advanced packaging for AI workloads. Teams from both companies will work on…
Key points
- Applied Materials and Intel collaborate at EPIC Center to accelerate AI chipmaking innovations for transistors, interconnects, and advanced packaging
- Focus on Foveros-based 3D stacking to improve interconnect density, power delivery, and thermal performance for AI workloads
- EPIC Center, launched in 2023, includes $4B in capital investments and aims to drive $25B in R&D over 10 years
The move builds on decades of collaboration between the two firms. Applied President and CEO Gary Dickerson called it a way to ‘shorten development cycles’ and bring AI-relevant technologies to market faster. Intel CEO Lip-Bu Tan emphasized the need for performance and power efficiency in AI computing, while Dr. Prabu Raja of Applied highlighted the complexity of modern chipmaking roadmaps. The EPIC Center, launched in 2023 with $4 billion in capital investments over seven years, was designed to reduce time-to-market for semiconductor innovations. It includes 180,000 square feet of cleanroom space and aims to drive $25 billion in R&D investments over its first decade, with support from the CHIPS and Science Act. The center’s founding partners included Intel, AMD, IBM, Micron, Nvidia, Samsung, TSMC, and Western Digital.
Applied Materials and Intel Partner on AI Chipmaking at EPIC Center
Unite.AI · 6 October 2026
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