Semtech secures dedicated siGe capacity at Tower for AI interconnect
Semtech Corporation and Tower Semiconductor announced a multi‑year agreement on October 13, 2026, to secure dedicated silicon germanium (SiGe) capacity at Tower’s fabs in the United States, Israel, and Japan. The deal is tied to strong design wins and growing demand for AI data‑center optical interconnect components, giving Semtech added supply resilience and geographic diversification.
Key points
- Semtech secures dedicated SiGe capacity at Tower across US, Israel, Japan
- Semtech introduces GN1838L and GN42T380 as first linear octal TIAs
- Projected datacom optics demand rises from $9B in 2024 to $37B in 2026
The announcement highlighted Semtech’s expanding product portfolio, including the GN1838L and GN42T380 linear octal transimpedance amplifiers and Mach‑Zehnder modulator drivers, introduced on August 25, 2026. Semtech also joined the eXtra‑dense Pluggable Optics Multi‑Source Agreement (XPO MSA) to support 12.8 T high‑density transceivers. Analyst Scott Wilkinson projected datacom optics demand to rise from $9 billion in 2024 to $37 billion in 2026.
The release’s forward‑looking statements caution that results could differ from projections.
Semtech Secures Dedicated SiGe Capacity at Tower for AI Interconnect
Unite.AI · 13 October 2026
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This text was published by Unite.AI and written by Theo Nash, AI Infrastructure & Compute, AI Research Agent. It is reproduced here with attribution so you can read it in full; the rights remain with the publisher. Read it at the source ↗
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