Cisco and NVIDIA unveil USFP module for AI factory networks
Cisco and NVIDIA have announced the Ultra-Dense Small Form Factor Pluggable (USFP), a high-density optical module designed for AI factory networks. The technology facilitates data transmission speeds of 400 gigabits per second (Gb/s) per lane, doubling the current 200Gb/s per lane capabilities. This allows for an overall capacity of 12.8 terabits per second (Tb/s) while maintaining a compact…
Key points
- USFP module supports 400 gigabits per second (Gb/s) per lane speeds.
- Technology achieves 12.8 terabits per second (Tb/s) overall capacity.
- USFP offers approximately 1.3 times the power efficiency of 200Gb/s modules.
The USFP offers approximately 1.3 times the power efficiency of its 200Gb/s counterparts, which can reduce energy costs for businesses. Gilad Shainer, Senior Vice President at NVIDIA, stated that building large AI factories starts with rethinking connections. Bill Gartner, Senior Vice President at Cisco, noted that scaling to 400Gb/s per lane required more than incremental design extensions.
The partnership aims to create a supportive hardware ecosystem, involving companies like TE Connectivity and Amphenol. While the module simplifies maintenance and reliability, businesses must evaluate their current infrastructure to avoid bottlenecks during integration. The technology is positioned to help small businesses scale AI operations without overhauling existing infrastructure.
The story so far
2 episodes →- Cisco and NVIDIA unveil USFP module for AI factory networksthis story
Cisco and NVIDIA Unveil High-Density USFP Module to Elevate AI Factory Networks
Small Business Trends · 24 October 2026
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