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Huawei reportedly plans to use Samsung, SK Hynix HBM in Ascend 960DT

Huawei has reportedly informed select clients that a significant portion of its upcoming Ascend 960DT flagship chip will utilize high-bandwidth memory (HBM) manufactured by Samsung and SK Hynix. This development highlights the porous nature of current U.S. restrictions on AI chip shipments to China, as the article notes that specific techniques allow for the circumvention of export controls.

1 source

Key points

  • Huawei told clients Ascend 960DT will use Samsung and SK Hynix HBM.
  • The move illustrates how porous U.S. AI chip export restrictions are.
  • The Information reported that Huawei recently shared this supply chain detail.

The report, sourced from The Information, suggests that despite regulatory barriers, Chinese manufacturers are finding ways to source critical components from major South Korean suppliers. The Ascend 960DT is positioned as a key upcoming product for Huawei in the AI hardware market. By relying on HBM from established industry leaders like Samsung and SK Hynix, Huawei aims to ensure the performance and reliability of its next-generation AI accelerator. This move underscores the complex supply chain dynamics and the ongoing challenges in enforcing export controls on advanced semiconductor components.

Read the original at theinformation.com · via TechmemeOpen source ↗
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HuaweiSamsungSK HynixThe InformationAscend 960DT

The headline, key points and digest above were generated by Digest AI's editorial model from the linked sources. Automated summaries can contain errors: the sources are the record. Spotted a mistake? Tell us. Published by Martin K., who runs Digest AI and handles corrections.

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