Infineon and NVIDIA advance 800 VDC power systems for AI data centers

This work builds on joint efforts announced in May and October 2025, which focused on enabling hot-swappable 800 VDC server racks. The new system solutions include GaN power switches, PSoC control C3, and EiceDRIVER product families. These components support conversion ratios from 800 V to 50 V, 12 V, and 6 V, allowing data center operators to optimize rack architectures for higher power density and efficiency. The partnership also covers power path protection solutions, including hot-swap controllers, to ensure safety and serviceability in high-density compute environments.

Jochen Hanebeck, CEO of Infineon, stated that semiconductors are central to solving the power infrastructure challenges posed by AI. The collaboration aims to address the extreme power draw of AI workloads, which are pushing rack power levels toward the megawatt range. By reducing distribution losses and shrinking magnetic components, the GaN-based systems help manage thermal limits and board area constraints in modern data centers.