Lotus Microsystems CEO explains power delivery’s role in AI scaling
Hans Hasselby-Andersen, CEO of Lotus Microsystems, argues that power delivery and thermal management are critical bottlenecks in AI infrastructure scaling. His background spans wireless systems, semiconductor development, and acquisitions like Merus Audio by Infineon, shaping his focus on energy-efficient solutions. Hasselby-Andersen highlights that traditional power architectures struggle with…
Key points
- Lotus Microsystems’ vStrata platform claims 96% efficiency and 25°C cooling gains for AI servers
- Traditional power delivery loses 7–10% of energy before reaching processors, per CEO estimates
- Hasselby-Andersen warns AI scaling requires integrated power, thermal, and packaging design
Lotus’s vStrata platform combines vertical power delivery with thermal management, claiming 96% point-of-load efficiency and 25°C temperature reductions. Hasselby-Andersen emphasizes that future AI performance gains depend on integrating power, cooling, and packaging design early, rather than treating them as separate challenges. He warns that current trends—like higher-power GPUs and custom accelerators—will push power demands toward 6,000–8,000 amps, requiring tighter collaboration between chipmakers, power specialists, and system engineers.
Hans Hasselby-Andersen, CEO of Lotus Microsystems
Unite.AI · 5 November 2026
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